# Mechanics and materials for electronic packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 (AMD), Vol. 1

By **American Society of Mechanical Engineers**

- ISBN-13: 9780791814499
- Publisher: American Society of Mechanical Engineers
- Pages: 3
- Published: 1 Jan 1994
- Language: en
- Categories: Electronic Packaging

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