Mechanics and materials for electronic packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 (AMD)American Society of Mechanical Engineers
Electronic Packaging
Mechanics and materials for electronic packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 (AMD)
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- Pages
- 3
- Published
- 1994
- Publisher
- American Society of Mechanical Engineers
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